BSI - 21/30431274 DC
Draft BS EN 61188-6-3 Ed.1.0 Circuit boards and circuit board assemblies - Design and use. Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
pending, Most Current
| Organization: | BSI |
| Publication Date: | 6 January 2021 |
| Status: | pending |
| Page Count: | 20 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
21/30431274 DC
January 6, 2021
Draft BS EN 61188-6-3 Ed.1.0 Circuit boards and circuit board assemblies - Design and use. Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
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