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BSI - BS PD IEC TR 61191-8

Printed board assemblies Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units — Best practices

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Organization: BSI
Publication Date: 31 March 2021
Status: active
Page Count: 38
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180

Document History

BS PD IEC TR 61191-8
March 31, 2021
Printed board assemblies Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units — Best practices
A description is not available for this item.

References

This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by IEC on June 1, 2019
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
This document references:
IEC 61189-5-601 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Published by IEC on February 1, 2021
This part of IEC 61189 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed...
This document references:
IEC 61191-2 - PRINTED BOARD ASSEMBLIES – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
Published by IEC on September 1, 2019
A description is not available for this item.
This document references:
IEC 61191-6 - Printed board assemblies – Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Published by IEC on January 1, 2010
This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is...
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