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IEC - 61191-6

Printed board assemblies – Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

active, Most Current
Organization: IEC
Publication Date: 1 January 2010
Status: active
Page Count: 80
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board.

This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package.

This standard is applicable to macrovoids of the sizes of from 10 μm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 μm in diameter.

This standard is intended for evaluation purposes and is applicable to

− research studies,

− off-line production process control and

− reliability assessment of assembly.

Document History

61191-6
January 1, 2010
Printed board assemblies – Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is...

References

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