IEC - 61760-2 (REDLINE + STANDARD)
Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide
active, Most Current
| Organization: | IEC |
| Publication Date: | 1 July 2021 |
| Status: | active |
| Page Count: | 52 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".
Document History
61760-2 (REDLINE + STANDARD)
July 1, 2021
Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide
This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting...