BSI - PD IEC TR 63378-1
Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
active, Most Current
| Organization: | BSI |
| Publication Date: | 31 January 2022 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
PD IEC TR 63378-1
January 31, 2022
Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
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