ETSI - TS 103 666-4
Smart Secure Platform (SSP); Part 4: Embedded SSP (eSSP) Type 2 characteristics (Release 17)
active, Most Current
| Organization: | ETSI |
| Publication Date: | 1 April 2022 |
| Status: | active |
| Page Count: | 19 |
scope:
The present document details the technical specifications for the Smart Secure Platform (SSP) in a discrete non removable hardware component, also known as eSSP. The present document defines specific attributes on top of the generic SSP specified in ETSI TS 103 666-1 [1] for eSSP Type 2, including the external interfaces (e.g. ISO 7816 [9], SPI, SWP). More in details the physical layer and related features are inherited from ETSI TS 103 666-3 [3] and the software architecture with virtualization interface, based on ETSI TS 103 666-2 [2].
Document History
TS 103 666-4
April 1, 2022
Smart Secure Platform (SSP); Part 4: Embedded SSP (eSSP) Type 2 characteristics (Release 17)
The present document details the technical specifications for the Smart Secure Platform (SSP) in a discrete non removable hardware component, also known as eSSP. The present document defines specific...