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ETSI - TS 103 666-3

Smart Secure Platform (SSP); Part 3: Embedded SSP (eSSP) Type 1 characteristics

active, Most Current
Organization: ETSI
Publication Date: 1 July 2020
Status: active
Page Count: 28
scope:

The present document details the technical specifications for the Smart Secure Platform (SSP) in a discrete hardware non removable component, also known as eSSP. The present document defines specific attributes on top of the generic SSP specified in ETSI TS 103 666-1 [1] for eSSP Type 1, including the external interfaces (e.g. ISO/IEC 7816-3 [11], SPI, SWP). The eSSP Type 1 class implements an operating system directly accessing the SSP hardware platform, as described in ETSI TS 103 666-1 [1] in clause 5.2.

Document History

TS 103 666-3
July 1, 2020
Smart Secure Platform (SSP); Part 3: Embedded SSP (eSSP) Type 1 characteristics
The present document details the technical specifications for the Smart Secure Platform (SSP) in a discrete hardware non removable component, also known as eSSP. The present document defines specific...

References

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