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ETSI - TS 103 666-4

Smart Secure Platform (SSP); Part 4: Embedded SSP (eSSP) Type 2 characteristics (Release 17)

active, Most Current
Organization: ETSI
Publication Date: 1 April 2022
Status: active
Page Count: 19
scope:

The present document details the technical specifications for the Smart Secure Platform (SSP) in a discrete non removable hardware component, also known as eSSP. The present document defines specific attributes on top of the generic SSP specified in ETSI TS 103 666-1 [1] for eSSP Type 2, including the external interfaces (e.g. ISO 7816 [9], SPI, SWP). More in details the physical layer and related features are inherited from ETSI TS 103 666-3 [3] and the software architecture with virtualization interface, based on ETSI TS 103 666-2 [2].

Document History

TS 103 666-4
April 1, 2022
Smart Secure Platform (SSP); Part 4: Embedded SSP (eSSP) Type 2 characteristics (Release 17)
The present document details the technical specifications for the Smart Secure Platform (SSP) in a discrete non removable hardware component, also known as eSSP. The present document defines specific...

References

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