IEC - TR 61760-3-1
Surface mounting technology – Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
active, Most Current
| Organization: | IEC |
| Publication Date: | 1 June 2022 |
| Status: | active |
| Page Count: | 30 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
This Part of IEC 61760 supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.
Document History
TR 61760-3-1
June 1, 2022
Surface mounting technology – Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
This Part of IEC 61760 supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and...