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IPC-7525

Stencil Design Guidelines

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Organization: IPC
Publication Date: 1 October 2011
Status: active
Page Count: 36
scope:

PURPOSE

This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the experience of stencil designers, fabricators, and users. Printing performance depends on many different variables and therefore no single set of design rules can be established.

Document History

IPC-7525
October 1, 2011
Stencil Design Guidelines
PURPOSE This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the...
February 1, 2007
Stencil Design Guidelines
This document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only as much of the content is based on the...
May 1, 2000
Stencil Design Guidelines
PURPOSE This document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only.  

References

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