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IPC - 7525C

Stencil Design Guidelines

active, Most Current
Organization: IPC
Publication Date: 1 November 2021
Status: active
Page Count: 36
scope:

Purpose

This document provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the experience of stencil designers, fabricators, and users. Printing performance depends on many different variables and therefore no single set of design rules can be established. Although this Handbook uses mandatory terminology, e.g., shall, must, etc., nothing within this Handbook is considered mandatory unless this document is specified as a mandatory requirement in the contract documentation.

Document History

7525C
November 1, 2021
Stencil Design Guidelines
Purpose This document provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on...
October 1, 2011
Stencil Design Guidelines
PURPOSE This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the...
February 1, 2007
Stencil Design Guidelines
This document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only as much of the content is based on the...
May 1, 2000
Stencil Design Guidelines
PURPOSE This document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only.  

References

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