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IPC-7525

Stencil Design Guidelines

inactive
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Organization: IPC
Publication Date: 1 May 2000
Status: inactive
Page Count: 28
scope:

PURPOSE

This document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only.

 

Document History

7525C
November 1, 2021
Stencil Design Guidelines
Purpose This document provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on...
IPC-7525
October 1, 2011
Stencil Design Guidelines
PURPOSE This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the...
IPC-7525
February 1, 2007
Stencil Design Guidelines
This document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only as much of the content is based on the...
IPC-7525
May 1, 2000
Stencil Design Guidelines
PURPOSE This document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only.  

References

This document references:
IPC-7095 - Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
Published by IPC on June 1, 2018
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design...
This document references:
IPC-A-610 - Acceptability of Electronic Assemblies
Published by IPC on October 1, 2017
This Standard is a collection of visual quality acceptability requirements for electronic assemblies. This Standard does not provide criteria for cross-section evaluation. This document presents...
This document references:
J-STD-005 - Requirements for Soldering Pastes
Published by IPC on February 1, 2012
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
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