UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

ETSI - TS 103 586

Environmental Engineering (EE); Liquid cooling solutions for Information and Communication Technology (ICT) infrastructure equipment

active, Most Current
Organization: ETSI
Publication Date: 1 October 2022
Status: active
Page Count: 26
scope:

The present document covers following applications:

• Liquid cooling at the cabinet/rack level.

• Liquid cooling at the product level.

• Liquid cooling via immersion in dielectric liquid.

The present document specifies the following items:

• Liquid circulation layout (connection of multiple units).

• Liquid flow rate range vs. dissipated power.

• Maximum pressure drop per liquid flow rate.

• Maximum pressure drop per air flow rate.

• External pipe diameter range and pipe threads.

• Valves requirements.

• Coolants and cooling distribution unites.

• Max pressure and tightness.

• Reliability requirement

Furthermore, the present document provides:

• Benchmark methods to evaluated different cooling system efficiency.

Document History

TS 103 586
October 1, 2022
Environmental Engineering (EE); Liquid cooling solutions for Information and Communication Technology (ICT) infrastructure equipment
The present document covers following applications: • Liquid cooling at the cabinet/rack level. • Liquid cooling at the product level. • Liquid cooling via immersion in dielectric liquid. The...
August 1, 2021
Environmental Engineering (EE); Liquid cooling solutions for Information and Communication Technology (ICT) infrastructure equipment
The present document covers following applications: • Liquid cooling at the cabinet/rack level. • Liquid cooling at the product level. • Liquid cooling via immersion in dielectric liquid. The...
April 1, 2019
Environmental Engineering (EE); Liquid cooling solutions for Information and Communication Technology (ICT) infrastructure equipment
The present document covers following applications: • Liquid cooling at the cabinet/rack level. • Liquid cooling at the product level. • Liquid cooling via immersion in dielectric liquid. The...

References

Advertisement