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BSI - 22/30383603 DC

Draft BS IEC 63215-4 Endurance test methods for die attach materials applied to power electronic devices Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices

pending, Most Current
Organization: BSI
Publication Date: 16 December 2022
Status: pending
Page Count: 21
ICS Code (Electronic component assemblies): 31.190

Document History

22/30383603 DC
December 16, 2022
Draft BS IEC 63215-4 Endurance test methods for die attach materials applied to power electronic devices Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices
A description is not available for this item.

References

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