BSI - 23/30454374 DC
Draft BS EN IEC 62047-47 Semiconductor devices - Micro-electromechanical devices Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
pending, Most Current
| Organization: | BSI |
| Publication Date: | 20 April 2023 |
| Status: | pending |
| Page Count: | 16 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
23/30454374 DC
April 20, 2023
Draft BS EN IEC 62047-47 Semiconductor devices - Micro-electromechanical devices Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
A description is not available for this item.