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IEC 62047-1

Semiconductor devices – Micro-electromechanical devices – Part 1: Terms and definitions

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Organization: IEC
Publication Date: 1 January 2016
Status: active
Page Count: 70
ICS Code (Other semiconductor devices): 31.080.99
scope:

This part of IEC 62047 defines terms for micro-electromechanical devices including the process of production of such devices

Document History

IEC 62047-1
January 1, 2016
Semiconductor devices – Micro-electromechanical devices – Part 1: Terms and definitions
This part of IEC 62047 defines terms for micro-electromechanical devices including the process of production of such devices
IEC 62047-1
September 1, 2005
Semiconductor devices Micro-electromechanical devices Part 1: Terms and definitions
A description is not available for this item.

References

This document references:
60050 - Vocabulary of Fundamental Concepts
Published by IEC on January 1, 1985
The I E C, the International Electrotechnical Commission, is entrusted with preparing the terminology covering all the concepts relating to electricity. This vocabulary (IEV) is grouped in some 80...
This document references:
IEC 60050-521 - AMENDMENT 2 International Electrotechnical Vocabulary (IEV) – Part 521: Semiconductor devices and integrated circuits
Published by IEC on December 1, 2018
A description is not available for this item.
This document references:
IEC 60050-815 - AMENDMENT 2 International Electrotechnical Vocabulary (IEV) – Part 815: Superconductivity
Published by IEC on April 1, 2020
A description is not available for this item.
This document references:
ISO 2041 - Mechanical vibration, shock and condition monitoring - Vocabulary
Published by ISO on October 1, 2018
This document defines terms and expressions unique to the areas of mechanical vibration, shock and condition monitoring.
This document is referenced by:
BS EN 62047-1 - Semiconductor devices Micro-electromechanical devices Part 1: Terms and definitions
Published by BSI on April 30, 2016
A description is not available for this item.
This document is referenced by:
IEC 60876-1 - Fibre optic interconnecting devices and passive components – Fibre optic spatial switches – Part 1: Generic specification
Published by IEC on August 1, 2014
This part of IEC 60876 applies to fibre optic switches possessing all of the following general features: – they are passive in that they contain no optoelectronic or other transducing elements; –...
This document is referenced by:
IEC 62047-14 - Semiconductor devices – Micro-electromechanical devices – Part 14: Forming limit measuring method of metallic film materials
Published by IEC on February 1, 2012
This part of IEC 62047 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials...
This document is referenced by:
IEC 60747-14-1 - Semiconductor devices – Part 14-1: Semiconductor sensors – Generic specification for sensors
Published by IEC on January 1, 2010
This part of IEC 60147-14 describes general items concerning the specifications for sensors, which are the basis for specifications given in other parts of this series for various types of sensors....
This document is referenced by:
IEC 62047-25 - Semiconductor devices – Micro-electromechanical devices – Part 25: Silicon based MEMS fabrication technology – Measurement method of pull-press and shearing strength of micro bonding area
Published by IEC on August 1, 2016
This part of IEC 62047 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based...
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