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BSI - 23/30448082 DC

Draft BS EN IEC 61810-7-16 Electrical relays – Tests and Measurements – Part 7-16: Soldering

pending, Most Current
Organization: BSI
Publication Date: 1 June 2023
Status: pending
Page Count: 16
ICS Code (Relays): 29.120.70

Document History

23/30448082 DC
June 1, 2023
Draft BS EN IEC 61810-7-16 Electrical relays – Tests and Measurements – Part 7-16: Soldering
A description is not available for this item.

References

This document references:
60068-2-17 - Environmental testing – Part 2-17: Tests – Test Q: Sealing
Published by IEC on June 1, 2023
This part of IEC 60068 deals with seal tests applicable to the external and internal detection in container sealing of gross leaks and fine leaks to determine the effectiveness of seals of specimens....
This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by IEC on June 1, 2019
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
This document references:
IEC 60068-2-83 - Environmental testing – Part 2-83: Tests – Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Published by IEC on September 1, 2011
This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these...
This document references:
IEC 60068-3-13 - Environmental testing – Part 3-13: Supporting documentation and guidance on Test T – Soldering
Published by IEC on May 1, 2016
This part of IEC 60068 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC...
This document references:
IEC 60749-21 - Semiconductor devices – Mechanical and climatic test methods – Part 21: Solderability
Published by IEC on April 1, 2011
This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or...
This document references:
IEC 61760-1 - Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by IEC on July 1, 2020
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set...
This document references:
IEC 61810-1 - Electromechanical elementary relays – Part 1: General and safety requirements
Published by IEC on November 1, 2019
This part of IEC 61810 applies to electromechanical elementary relays (non-specified time allor- nothing relays) for incorporation into low voltage equipment (circuits up to 1 000 V alternate current...
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