IEC - TR 61760-5-1
Surface mounting technology – Part 5-1: Surface strain on circuit boards – Strain gauge measurement applied to chip components
active, Most Current
| Organization: | IEC |
| Publication Date: | 1 January 2024 |
| Status: | active |
| Page Count: | 28 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
This document describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called "bending cracks". Area-array components are excluded from the scope of this document.
Document History
TR 61760-5-1
January 1, 2024
Surface mounting technology – Part 5-1: Surface strain on circuit boards – Strain gauge measurement applied to chip components
This document describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic...