BSI - BS EN 62047-13
Semiconductor devices - Micro-electromechanical devices Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
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| Organization: | BSI |
| Publication Date: | 31 May 2012 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
BS EN 62047-13
May 31, 2012
Semiconductor devices - Micro-electromechanical devices Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
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