IEC 62047-2
Semiconductor devices – Micro-electromechanical devices – Part 2: Tensile testing method of thin film materials
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| Organization: | IEC |
| Publication Date: | 1 August 2006 |
| Status: | active |
| Page Count: | 34 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
scope:
This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 μm, which are main structural materials for micro-electromechani
The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
Document History
IEC 62047-2
August 1, 2006
Semiconductor devices – Micro-electromechanical devices – Part 2: Tensile testing method of thin film materials
This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 μm, which are main structural materials for...