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IEC 62047-2

Semiconductor devices – Micro-electromechanical devices – Part 2: Tensile testing method of thin film materials

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Organization: IEC
Publication Date: 1 August 2006
Status: active
Page Count: 34
ICS Code (Other semiconductor devices): 31.080.99
scope:

This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 μm, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.

The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.

 

Document History

IEC 62047-2
August 1, 2006
Semiconductor devices – Micro-electromechanical devices – Part 2: Tensile testing method of thin film materials
This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 μm, which are main structural materials for...

References

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