Semiconductor devices – Micro-electromechanical devices – Part 2: Tensile testing method of thin film materials
|Publication Date:||1 August 2006|
|ICS Code (Other semiconductor devices):||31.080.99|
This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 μm, which are main structural materials for micro-electromechani
The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.