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IEC 62047-13

Semiconductor devices – Micro-electromechanical devices – Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

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Organization: IEC
Publication Date: 1 February 2012
Status: active
Page Count: 34
ICS Code (Other semiconductor devices): 31.080.99
scope:

This part of IEC 62047 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively.

Micro-sized elements of MEMS devices are made up of laminated fine pattern films on a substrate, which are fabricated by deposition, plating, and/or coating with photolithography. MEMS devices include a large number of interfaces between dissimilar materials, at which delamination occasionally occurs during fabrication or in operation. Combination of the materials at the junction determines the adhesive strength; moreover, defects and residual stress in the vicinity of the interface, which are changing by processing condition, strongly affect the adhesive strength. This standard specifies the adhesive testing method for microsized- elements in order to optimally select materials and processing conditions for MEMS devices.

This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.

Document History

IEC 62047-13
February 1, 2012
Semiconductor devices – Micro-electromechanical devices – Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
This part of IEC 62047 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to...

References

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