Semiconductor devices – Micro-electromechanical devices – Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
|Publication Date:||1 September 2011|
|ICS Code (Other semiconductor devices):||31.080.99|
This part of IEC 62047 specifies a method for bending fatigue
testing using resonant vibration of microscale mechanical
structures of MEMS (micro-electromechan
The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.