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CENELEC - EN 62047-6

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

active, Most Current
Organization: CENELEC
Publication Date: 1 March 2010
Status: active
Page Count: 20
ICS Code (Other semiconductor devices): 31.080.99
scope:

This International Standard specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines.

The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.

Document History

EN 62047-6
March 1, 2010
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
This International Standard specifies the method for axial tensile–tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm...

References

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