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BSI - BS EN 62047-18

Semiconductor devices — Micro-electromechanical devices Part 18: Bend testing methods of thin film materials

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Organization: BSI
Publication Date: 31 October 2013
Status: active
Page Count: 18
ICS Code (Other semiconductor devices): 31.080.99

Document History

BS EN 62047-18
October 31, 2013
Semiconductor devices — Micro-electromechanical devices Part 18: Bend testing methods of thin film materials
A description is not available for this item.

References

This document references:
EN 62047-6 - Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Published by CENELEC on March 1, 2010
This International Standard specifies the method for axial tensile–tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm...
This document references:
IEC 62047-6 - Semiconductor devices – Micro-electromechanical devices – Part 6: Axial fatigue testing methods of thin film materials
Published by IEC on April 1, 2009
A description is not available for this item.
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