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IEC 62047-6

Semiconductor devices – Micro-electromechanical devices – Part 6: Axial fatigue testing methods of thin film materials

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Organization: IEC
Publication Date: 1 April 2009
Status: active
Page Count: 34
ICS Code (Other semiconductor devices): 31.080.99

Document History

IEC 62047-6
April 1, 2009
Semiconductor devices – Micro-electromechanical devices – Part 6: Axial fatigue testing methods of thin film materials
A description is not available for this item.

References

This document is referenced by:
IEC 62047-18 - Semiconductor devices – Micro-electromechanical devices – Part 18: Bend testing methods of thin film materials
Published by IEC on July 1, 2013
This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm. Thin films are used as...
This document is referenced by:
EN 62047-18 - Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Published by CENELEC on September 1, 2013
This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm. Thin films are used as...
This document is referenced by:
CEI EN 62047-18 - Semiconductor devices - Micro-electromechanical devices Part 18: Bend testing methods of thin film materials
Published by CEI on April 1, 2014
This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm. Thin films are used as...
This document is referenced by:
DIN EN 62047-18 - Semiconductor devices - Micro-electromechanical devices - Part 18: Bending test methods of thin film materials (IEC 47F/76/CD:2011)
Published by DIN on June 1, 2011
This international standard specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0.1 μm and 10 μm. Thin films are used...
This document is referenced by:
DIN EN 62047-18 - Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
Published by DIN on April 1, 2014
Der vorliegende Teil von IEC 62047 legt das Biegeprüfverfahren für Dünnschichtwerkstoffe mit einer Länge und einer Breite von jeweils unter 1 mm und einer Dicke im Bereich von 0,1 μm bis 10 μm fest....
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