scope:

This international standard specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0.1 μm and 10 μm. Thin films are used as main structural materials for MEMS and micromachines.

The main structural materials for MEMS, micromachines, etc., have special features, such as a few microns, material fabrication by deposition, and test piece fabrication by means of nonmechanical machining, including photolithography. This International Standard specifies the bend testing for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features..