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IEC 62047-18

Semiconductor devices – Micro-electromechanical devices – Part 18: Bend testing methods of thin film materials

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Organization: IEC
Publication Date: 1 July 2013
Status: active
Page Count: 30
ICS Code (Other semiconductor devices): 31.080.99
scope:

This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm. Thin films are used as main structural materials for Micro-electromechanical Systems (abbreviated as MEMS in this document) and micromachines.

The main structural materials for MEMS, micromachines, etc., have special features, such as a few micron meter size, material fabrication by deposition, photolithography, and/ or nonmechanical machining test piece. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

Document History

IEC 62047-18
July 1, 2013
Semiconductor devices – Micro-electromechanical devices – Part 18: Bend testing methods of thin film materials
This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm. Thin films are used as...

References

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