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IPC/JEDEC-9704 CHINESE

Printed Wiring Board Strain Gage Test Guideline

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Organization: IPC
Publication Date: 1 February 2012
Status: active
Page Count: 36

Document History

IPC/JEDEC-9704 CHINESE
February 1, 2012
Printed Wiring Board Strain Gage Test Guideline
A description is not available for this item.
June 1, 2005
Printed Wiring Board Strain Gage Test Guideline
本文件对印制板(PWB)制造过程中印制板组 件的应变测试制定了详细的指南,这些制造过 程包括组装、测试、系统集成及印制板的周转/ 运输。 本文件建议的程序使印制板组装厂能够独立进 行所要求的应变测试,并为印制板翘曲测量和 风险等级评估提供了量化的方法。 本文件所涵盖的主题包括: 测试设置和仪器要求 应变测量 报告格式 本文件中所提到的器件均假定为表面贴装器...

References

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