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IEC TR 62866

Electrochemical migration in printed wiring boards and assemblies – Mechanisms and testing

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Organization: IEC
Publication Date: 1 May 2014
Status: active
Page Count: 192
ICS Code (Printed circuits and boards): 31.180
scope:

This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

Document History

IEC TR 62866
May 1, 2014
Electrochemical migration in printed wiring boards and assemblies – Mechanisms and testing
This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing...

References

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