IEC TR 62866
Electrochemical migration in printed wiring boards and assemblies – Mechanisms and testing
active, Most Current
Buy Now
| Organization: | IEC |
| Publication Date: | 1 May 2014 |
| Status: | active |
| Page Count: | 192 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
Document History
IEC TR 62866
May 1, 2014
Electrochemical migration in printed wiring boards and assemblies – Mechanisms and testing
This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing...