IPC-TR-585
Time, Temperature and Humidity Stress of Final Board Finish Solderability
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| Organization: | IPC |
| Publication Date: | 1 May 2006 |
| Status: | active |
| Page Count: | 64 |
scope:
PURPOSE
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust finish will fail. The stress test need not duplicate real world environment (fabrication through assembly), but it must correlate to solderability performance.
Document History
IPC-TR-585
May 1, 2006
Time, Temperature and Humidity Stress of Final Board Finish Solderability
PURPOSE
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non...