BSI - BS 3934-5
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations Applying to Tape Automated Bonding (TAB) of Integrated Circuits
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| Organization: | BSI |
| Publication Date: | 15 September 1997 |
| Status: | active |
| Page Count: | 38 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
Document History
BS 3934-5
September 15, 1997
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations Applying to Tape Automated Bonding (TAB) of Integrated Circuits
Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
April 1, 1992
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits
Recommendations cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage...
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