IPC - TM-650 2.4.35
Solder Paste - Slump Test
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 January 1995 |
| Status: | active |
| Page Count: | 3 |
scope:
This procedure determines vertical and horizontal slump for solder pastes.
Document History
TM-650 2.4.35
January 1, 1995
Solder Paste - Slump Test
This procedure determines vertical and horizontal slump for solder pastes.