NPFC - MIL-T-81955
TIN PLATING, IMMERSION FOR COPPER AND COPPER ALLOYS
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| Organization: | NPFC |
| Publication Date: | 15 November 1973 |
| Status: | active |
| Page Count: | 9 |
scope:
This specification covers the requirements for tin plating deposited by immersion, without an external potential, on copper and copper alloys.
Deposited tin plating shall be of the following classes as specified (see 6.2):
Class 1 - 0.000076 to 0.0001 inch thick
Class 2 - 0.000051 to 0.000075 inch thick
Class 3 - 0.000026 to 0.000050 inch thick
Class 4 - 0.000025 inch or less thick
intended Use:
The tin plating covered in this specification is intended for use as a base for soldering printed circuitry and microwave parts and components. The thin plating, ranging up to 100 millionths of an... View More
Document History
October 7, 1982
TIN PLATING, IMMERSION FOR COPPER AND COPPER ALLOYS
A description is not available for this item.
July 14, 1982
TIN PLATING, IMMERSION FOR COPPER AND COPPER ALLOYS
A description is not available for this item.
MIL-T-81955
November 15, 1973
TIN PLATING, IMMERSION FOR COPPER AND COPPER ALLOYS
The tin plating covered in this specification is intended for use as a base for soldering printed circuitry and microwave parts and components. The thin plating, ranging up to 100 millionths of an...