UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC-SMC-TR-001

Introduction to Tape Automated Bonding & Fine Pitch Technology

active, Most Current
Buy Now
Organization: IPC
Publication Date: 1 January 1989
Status: active
Page Count: 73

Document History

IPC-SMC-TR-001
January 1, 1989
Introduction to Tape Automated Bonding & Fine Pitch Technology
A description is not available for this item.

References

This document is referenced by:
IPC-SMC-WP-003 - Chip Mounting Technology (CMT)
Published by IPC on August 1, 1993
INTRODUCTION The purpose of this paper is to investigate emerging chip attachment methods and define and classify the attachment methods for electronic systems designers and manufacturers today. The...
This document is referenced by:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document is referenced by:
IPC-2221 CHINESE - Generic Standard on Printed Board Design
Published by IPC on May 1, 2003
This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be...
This document is referenced by:
IPC-2221 GERMAN - Generic Standard on Printed Board Design
Published by IPC on November 1, 2012
A description is not available for this item.
View Less
View All
Advertisement