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IPC - TM-650 2.4.34.1

Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centerpoise)

active, Most Current
Organization: IPC
Publication Date: 1 January 1995
Status: active
Page Count: 2
scope:

This test specifies a standard procedure for determining the viscosity of solder paste in the range of 50,000 to 300,000 centipoise.

Document History

TM-650 2.4.34.1
January 1, 1995
Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centerpoise)
This test specifies a standard procedure for determining the viscosity of solder paste in the range of 50,000 to 300,000 centipoise.

References

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