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IPC-TM-650 2.3.15

Purity, Copper Foil or Plating

active, Most Current
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Organization: IPC
Publication Date: 1 May 2004
Status: active
Page Count: 2
scope:

This is an electrogravimetric method for determining the purity of copper foil or plating.

Document History

IPC-TM-650 2.3.15
May 1, 2004
Purity, Copper Foil or Plating
This is an electrogravimetric method for determining the purity of copper foil or plating.
TM-650 2.3.15C
August 1, 1997
Purity, Copper Foil or Plating
A description is not available for this item.
TM-650 2.3.15C
June 1, 1991
Purity of Copper Foil
A description is not available for this item.

References

This document is referenced by:
IPC-6013 - Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards
Published by IPC on April 1, 2018
A description is not available for this item.
This document is referenced by:
MIL-PRF-55110 - PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
Published by NPFC on May 16, 2020
Scope. This specification establishes the performance and qualification requirements for rigid single-sided, double-sided, and multilayered printed wiring boards with or without plated through holes...
This document is referenced by:
IPC-6018 - Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Published by IPC on July 1, 2016
Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline...
This document is referenced by:
IPC-6012 GERMAN - Qualifikation und Leistungsspezifikation für starre Leiterplatten
Published by IPC on March 1, 2020
A description is not available for this item.
This document is referenced by:
IPC-6012 - Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on August 1, 2020
This Specification covers qualification and performance requirements of Rigid Printed Board for Medical Device Applications. The Printed Boards may have a design that contains HDI and Design Level D...
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