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IPC-TR-462

Solderability Evaluation of Printed Boards with Protective Coatings over a Long Term Storage

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Organization: IPC
Publication Date: 1 October 1987
Status: active
Page Count: 74
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The Round Robin Test Program had the following objectives. Determine the effectiveness of different protective coatings, and methods of coating application, on printed wiring boards. Coatings were to be applied over a variety of conductor patterns, land configurations, plated and nonplated holes, on PWBs with and without solder mask. Provide insight into PWB solderability after various time periods in typical storage conditions, and correlate this data with the thickness and characteristics of the coating. Determine if various patterns of conductors, lands, spacing and configuration contributed to the soldering characteristics.

Document History

IPC-TR-462
October 1, 1987
Solderability Evaluation of Printed Boards with Protective Coatings over a Long Term Storage
The Round Robin Test Program had the following objectives. Determine the effectiveness of different protective coatings, and methods of coating application, on printed wiring boards. Coatings were to...

References

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