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IPC - TM-650 2.6.9B

Vibration, Rigid Printed Wiring

active, Most Current
Organization: IPC
Publication Date: 1 May 2004
Status: active
Page Count: 1
scope:

This test describes a procedure which may be conducted to determine if a printed wiring board is constructed to withstand the dynamic vibrational stresses that may be encountered during field service. This test method provides specific parameters for one application in order to present the proper procedures. Specific test conditions must be agreed upon by the customer and the vendor.

Document History

TM-650 2.6.9B
May 1, 2004
Vibration, Rigid Printed Wiring
This test describes a procedure which may be conducted to determine if a printed wiring board is constructed to withstand the dynamic vibrational stresses that may be encountered during field...
August 1, 1997
Vibration, Rigid Printed Wiring
A description is not available for this item.
July 1, 1975
Vibration, Rigid Printed Wiring
A description is not available for this item.

References

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