DLA - SMD-5962-87603 REV B
MICROCIRCUIT, HIGH PERFORMANCE CMOS 9-WIDE AND 10-WIDE BUS INTERFACE LATCHES, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 2 November 1992 |
| Status: | active |
| Page Count: | 16 |
scope:
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 29C841 High performance CM0S 10-wide bus interface latch 02 29C843 High performance CMOS 9-wide bus interface latch 03 29C941 High performance CMOS 10-wide bus interface latch 1/ 04 29C943 High performance CM0S 9-wide bus interface latch 1/ 05 29C841A High performance CMOS 10-wide bus interface latch 06 29C843A High performance CMOS 9-wide bus interface latch
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline Letter Descriptive designator Terminals Package style K GDFP2-F24 or 24 Flat package CDFP3-F24 L GDIP3-T24 or 24 Dual-in-line package CDIP4-F24 3 CQCC1-N28 28 Square chip carrier
Supply voltage range . . . . . . . . . . . . . . . −0.5 V dc to +7.0 dc Input voltage range. . . . . . . . . . . . . . . . −0.5 V dc to 6.0 V dc Output voltage range . . . . . . . . . . . . . . . −0.5 V dc to 6.0 V dc Storage temperature range. . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation PD . . . . . . . . . . . 500 mW DC output diode current: Into input . . . . . . . . . . . . . . . . . . . +50 mA Out of input . . . . . . . . . . . . . . . . . . −50 mA DC output diode current: Into input . . . . . . . . . . . . . . . . . . . +20 mA Out of input . . . . . . . . . . . . . . . . . . −20 mA DC output current per pin: Isink. Device types 01 - 04 . . . . . . . . . . . . . +48 mA (2 × IOL) Device types 05, 06 . . . . . . . . . . . . . +100 mA Isource Device types 01 - 04 . . . . . . . . . . . . . −30 mA (2 × IOL) Device types 05, 06. . . . . . . . . . . . . . −100 mA Total dc ground current. . . . . . . . . . . . . . (n × IOL + m × ICCT) mA 2/ Total dc VCC. . . . . . . . . . . . . . . . . . . (n × IOL + m × ICCT) mA 2/ Lead temperature (soldering, 10 seconds) . . . . . +300°C Thermal resistance, junction-to-case (ΘJC): Cases K, L, and 3 . . . . . . . . . . . . . . . See MIL-STD-1835 Junction temperature (TJ) . . . . . . . . . . . . +150°C
Supply voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH) . . . . . . . . . . . . . . . . . . 2.0 V dc Maximum Low level input voltage (VIL) . . . . . . . . . . . . . . . . . . 0.8 V dc Case operating temperature range (TC) . . . . . . . . . . . . . . . . . 55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More
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