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NPFC - MIL-STD-1835

Electronic Component Case Outlines

active, Most Current
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Organization: NPFC
Publication Date: 21 September 2009
Status: active
Page Count: 1
scope:

This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and logistically supportable electronic equipment.

Purpose. The purpose of this standard is to assure complete mechanical interchangeability of all electronic component case outlines of a particular style and type, regardless of source, commensurate with the requirements of high density electronic equipment manufacturing.

intended Use:

Packages conforming to the requirements of this standard are intended for use in electronic equipment.

Document History

April 15, 2019
Electronic Component Case Outlines
A description is not available for this item.
June 25, 2014
Electronic Component Case Outlines
A description is not available for this item.
MIL-STD-1835
September 21, 2009
Electronic Component Case Outlines
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
June 1, 2004
ELECTRONIC COMPONENT CASE OUTLINES
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
August 15, 2000
ELECTRONIC COMPONENT CASE OUTLINES
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
ELECTRONIC COMPONENT CASE OUTLINES
This standard establishes and maintains a compilation of microelectronic package case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
April 12, 1999
ELECTRONIC COMPONENT CASE OUTLINES
This standard establishes and maintains a compilation of microelectronic package case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
December 15, 1997
ELECTRONIC COMPONENT CASE OUTLINES
A description is not available for this item.
February 26, 1997
ELECTRONIC COMPONENT CASE OUTLINES
Packages conforming to the requirements of this standard are intended for use in military electronic equipment.
September 3, 1996
ELECTRONIC COMPONENT CASE OUTLINES
This standard establishes and maintains a compilation of microelectronic package case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
February 28, 1995
ELECTRONIC COMPONENT CASE OUTLINES
Packages conforming to the requirements of this standard are intended for use in military electronic equipment.
February 1, 1994
ELECTRONIC COMPONENT CASE OUTLINES
This standard establishes and maintains a compilation of microelectronic package case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
February 26, 1993
ELECTRONIC COMPONENT CASE OUTLINES
A description is not available for this item.
June 30, 1992
ELECTRONIC COMPONENT CASE OUTLINES
A description is not available for this item.
September 30, 1991
ELECTRONIC COMPONENT CASE OUTLINES
A description is not available for this item.

References

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