This document references:
IPC-HM-860 - Specification for Multilayer Hybrid Circuits
Published by IPC
on
January 1, 1987
This specification covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns...
This document references:
IPC-D-351 - Printed Board Drawings in Digital Form
Published by IPC
on
August 1, 1985
The data contained in this specification is intended to supplement ANSI/IPC-D-350, specifically in the area of describing printed wiring board related drawings in digital form. It is intended that...
This document references:
IPC-HM-860 - Specification for Multilayer Hybrid Circuits
Published by IPC
on
January 1, 1987
This specification covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns...
This document is referenced by:
ASME Y14.24 - Types and Applications of Engineering Drawings
Published by ASME
on
October 23, 2020
This Standard defines the types of engineering drawings most frequently used to establish engineering requirements. It describes typical applications and minimum content requirements. Drawings for...
This document is referenced by:
IPC-PD-335 - Electronic Packaging Handbook
Published by IPC
on
December 1, 1989
Purpose of the IPC Electronic Packaging Handbook The purpose of this Electronic Packaging Handbook is to provide the appropriate insight and flows into the multifaceted topic of electronic packaging....
