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IPC-D-859

Design Standard for Thick Film Multilayer Hybrid Circuits

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Organization: IPC
Publication Date: 1 December 1989
Status: active
Page Count: 88
scope:

This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities.

 

Document History

IPC-D-859
December 1, 1989
Design Standard for Thick Film Multilayer Hybrid Circuits
This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities.  

References

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