scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 DS3886 BTL 9-bit latching data transceiver

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 48 flat package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - - 6.5 V Control input voltage- - - - - - - - - - - - - - - - - - - 6.5 V Driver input and receiver output - - - - - - - - - - - - - 5.5 V Bus termination voltage - - - - - - - - - - - - - - - - - 2.4 V Receiver input current - - - - - - - - - - - - - - - - - - ±15 mA Storage temperature range (T_STG) - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) 2/ - - - - - - - - - - - - 1.7 W Lead temperature (soldering, 4 seconds) - - - - - - - - - +260°C Junction temperature (T_J) - - - - - - - - - - - - - - - - +175°C Thermal resistance, junction-to-case (θ_JC) - - - - - - - - See MIL-STD-1835 Thermal resistance, junction-to-ambient (θ_JA) - - - - - - 87 C/W

Supply voltage range (V+) - - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V Bus termination voltage (V_t) - - - - - - - - - - - - - - - - 2.06 V to 2.14 V Ambient operating temperature range (T_A) - - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - 3/ XX percent

intended Use: