BSI - BS EN 60191-6-3
Mechanical Standardization of Semiconductor Devices - Part 6-3: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Measuring Methods for Package Dimensions of Quad Flat Packs (QFP)
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| Organization: | BSI |
| Publication Date: | 15 May 2001 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
BS EN 60191-6-3
May 15, 2001
Mechanical Standardization of Semiconductor Devices - Part 6-3: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Measuring Methods for Package Dimensions of Quad Flat Packs (QFP)
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