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NAVY - NAV MIL-HDBK-419 REV A VOL 1

GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES

active, Most Current
Organization: NAVY
Publication Date: 29 December 1987
Status: active
Page Count: 812
scope:

GENERAL.

This handbook addresses the practical considerations for engineering of grounding systems, subsystems, and other components of ground networks. Electrical noise reduction is discussed as it relates to the proper installation of ground systems. Power distribution systems are covered to the degree necessary to understand the interrelationships between grounding, power distribution, and electrical noise reduction.

The information provided in this handbook primarily concerns grounding, bonding, and shielding of fixed plant telecommunications-electronics facilities; however, it also provides basic guidance in the grounding of deployed transportable communications/electronics equipment.

Grounding, bonding, and shielding are approached from a total system concept, which comprises four basic subsystems in accordance with current Department of Defense (DOD) guidance. These subsystems are as follows:

a. An earth electrode subsystem.

b. A lighting protection substem.

c. A fault protection subsystem.

d. A signal reference substem.

Document History

NAV MIL-HDBK-419 REV A VOL 1
December 29, 1987
GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES
GENERAL. This handbook addresses the practical considerations for engineering of grounding systems, subsystems, and other components of ground networks. Electrical noise reduction is discussed as it...

References

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