NAVY - NAV MIL-HDBK-419 REV A VOL 1
GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES
| Organization: | NAVY |
| Publication Date: | 29 December 1987 |
| Status: | active |
| Page Count: | 812 |
scope:
GENERAL.
This handbook addresses the practical considerations for engineering of grounding systems, subsystems, and other components of ground networks. Electrical noise reduction is discussed as it relates to the proper installation of ground systems. Power distribution systems are covered to the degree necessary to understand the interrelationships between grounding, power distribution, and electrical noise reduction.
The information provided in this handbook primarily concerns
grounding, bonding, and shielding of fixed plant
telecommunications-e
Grounding, bonding, and shielding are approached from a total system concept, which comprises four basic subsystems in accordance with current Department of Defense (DOD) guidance. These subsystems are as follows:
a. An earth electrode subsystem.
b. A lighting protection substem.
c. A fault protection subsystem.
d. A signal reference substem.
Document History