MODUK - DEF STAN 80-105
Adhesive, Epoxide, Two-Part (Solventless), Hot Curing No 4
inactive, Most Current
| Organization: | MODUK |
| Publication Date: | 1 January 1985 |
| Status: | inactive |
| Page Count: | 10 |
scope:
This Standard relates to a two-part, (Parts A and B), hot-curing epoxide resin adhesive giving high strength bonds to materials which are maintained at temperatures up to 200°C.
Part A is available in three grades, standard grade, filled grade and putty grade, which differ only in the viscosity requirement.
Document History
DEF STAN 80-105
January 1, 1985
Adhesive, Epoxide, Two-Part (Solventless), Hot Curing No 4
This Standard relates to a two-part, (Parts A and B), hot-curing epoxide resin adhesive giving high strength bonds to materials which are maintained at temperatures up to 200°C.
Part A is available...