IPC - TM-650 2.4.18.1A
Tensile Strength and Elongation, In-House Plating
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 May 2004 |
| Status: | active |
| Page Count: | 3 |
scope:
To determine the tensile strength in Mpa (PSI) and the elongation, in percentage, of electrodeposited copper plating at ambient temperatures by mechanical force testing.
Document History
TM-650 2.4.18.1A
May 1, 2004
Tensile Strength and Elongation, In-House Plating
To determine the tensile strength in Mpa (PSI) and the elongation, in percentage, of electrodeposited copper plating at ambient temperatures by mechanical force testing.
August 1, 1997
Tensile Strength and Elongation, In-House Plating
A description is not available for this item.
January 1, 1996
Tensile Strength and Elongation, In-House Plating
A description is not available for this item.