UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC-2223 GERMAN

Sectional Design Standard for Flexible Printed Boards

active, Most Current
Buy Now
Organization: IPC
Publication Date: 1 November 2011
Status: active
Page Count: 52

Document History

IPC-2223 GERMAN
November 1, 2011
Sectional Design Standard for Flexible Printed Boards
A description is not available for this item.
IPC-2223 GERMAN
May 1, 2008
Sectional Design Standard for Flexible Printed Boards
A description is not available for this item.
IPC-2223 GERMAN
June 1, 2004
Sectional Design Standard for Flexible Printed Boards
Diese Richtlinie legt die Anforderungen an das Design von flexiblen Leiterplatten und die Arten der Bauteilmontage und Verbindungsstrukturen fest. Die in den Strukturen verwendeten flexiblen...

References

This document references:
IPC-2615 - Printed Board Dimensions and Tolerances
Published by IPC on July 1, 2000
This Standard covers dimensioning and tolerancing of electronic packaging as it relates to printed boards and the assembly of printed boards. The concepts defined in this Standard are derived from...
This document references:
IPC-SM-840 - Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
Published by IPC on December 1, 2010
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test...
This document references:
TM-650 2.4.18.1A - Tensile Strength and Elongation, In-House Plating
Published by IPC on May 1, 2004
To determine the tensile strength in Mpa (PSI) and the elongation, in percentage, of electrodeposited copper plating at ambient temperatures by mechanical force testing.
This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document references:
IPC-4203 - Cover and Bonding Material for Flexible Printed Circuitry
Published by IPC on March 1, 2018
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as...
This document references:
IPC-4202 - Flexible Base Dielectrics for Use in Flexible Printed Boards
Published by IPC on December 1, 2016
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
This document references:
IPC-9252 - Requirements for Electrical Testing of Unpopulated Printed Boards
Published by IPC on September 1, 2016
This document is intended to assist in selecting the test analyzer, test parameters, test data, and fixturing required to perform electrical test(s) on all unpopulated printed boards. The testing of...
This document is referenced by:
DIN IEC/TS 62647-1 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan (IEC/TS 62647-1:2012)
Published by DIN on July 1, 2013
Dieser Teil der Reihe IEC/TS 62647 legt die Ziele und Anforderungen für die Dokumentation von Prozessen fest, die Kunden und regelsetzenden Stellen versichern, dass elektronische ADHP-Systeme, die...
View Less
View All
Advertisement