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IPC - AM-372

Electroless Copper Film for Additive Printed Boards

inactive, Most Current
Organization: IPC
Publication Date: 1 January 1978
Status: inactive
Page Count: 10

Document History

AM-372
January 1, 1978
Electroless Copper Film for Additive Printed Boards
A description is not available for this item.

References

This document is referenced by:
IPC-DW-424 - General Specification for Encapsulated Discrete Wire Interconnection Board
Published by IPC on January 1, 1995
This specification establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards having wires which terminate in plated holes.
This document is referenced by:
IPC-2225 - Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
Published by IPC on May 1, 1998
This standard establishes requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of organic mounting structure used to interconnect chip...
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