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IPC - TM-650 2.2.10A

Hole Location and Conductor Location

inactive, Most Current
Organization: IPC
Publication Date: 1 December 1983
Status: inactive
Page Count: 1
scope:

This is a nondestructive test that may be used at any time during the preproduction phase of printed wiring board manufacturing.

Document History

TM-650 2.2.10A
December 1, 1983
Hole Location and Conductor Location
This is a nondestructive test that may be used at any time during the preproduction phase of printed wiring board manufacturing.

References

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