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IPC - TM-650 2.6.5D

Physical Shock, Multilayer Printed Wiring

active, Most Current
Organization: IPC
Publication Date: 1 May 2004
Status: active
Page Count: 1
scope:

This method is to determine the electrical performance of multilayer printed wiring boards by following the shock with an electrical continuity test as specified.

Document History

TM-650 2.6.5D
May 1, 2004
Physical Shock, Multilayer Printed Wiring
This method is to determine the electrical performance of multilayer printed wiring boards by following the shock with an electrical continuity test as specified.
TM-650 2.6.5C
August 1, 1997
Physical Shock, Multilayer Printed Wiring
A description is not available for this item.
TM-650 2.6.5B
December 1, 1987
Physical Shock, Multilayer Printed Wiring
A description is not available for this item.

References

This document is referenced by:
IPC-6015 - Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures
Published by IPC on February 1, 1998
This specification establishes the specific requirements for the organic mounting structure used to interconnect chip components, which in combination form the completed functional Organic...
This document is referenced by:
9701B - Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Published by IPC on February 1, 2022
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be...
This document is referenced by:
IPC-6012 SWEDISH - Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on August 1, 2004
Denna specifikation omfattar kvalificering av och utförande hos rigida mönsterkort. Mönsterkortet kan vara enkelsidigt, dubbelsidigt, med eller utan genompläterade hål. Det kan också vara ett...
This document is referenced by:
IPC-6012 ITALIAN - Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on August 1, 2004
Dichiarazione degli obiettivi Questa specifica riguarda la qualificazione ed i requisiti dei circuiti stampati rigidi. I circuiti stampati possono essere monofaccia, doppiafaccia con o senza fori...
This document is referenced by:
IPC-HM-860 - Specification for Multilayer Hybrid Circuits
Published by IPC on January 1, 1987
This specification covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns...
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